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XThin(R) LEDs
CxxxXT290-Sxx00-x
Cree's XThin LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree's proprietary G*SiC(R) substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single wire bond connection. These vertically structured LED chips are approximately 115 microns in height and require a low forward voltage. Cree's XTTM chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000V ESD. Applications for XThin include next-generation mobile appliances for use in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption are required.
FEATURES
* XThin LED Performance - Blue XT-12TM - 12.0 mW min. XT-16TM - 16.0 mW min. XT-18TM - 18.0 mW min. XT-21TM - 21.0 mW min. XT-24TM - 24.0 mW min. - Green - 7.0 mW min. Low Forward Voltage - 3.2 V Typical at 20 mA Class 2 ESD Rating Sn Contact for Low-Temp. Die Attach Methods Die Attach Options - Flux Eutectic; Flux & Temperature (-C) - Eutectic; Temperature & Pressure (-D)
APPLICATIONS
* * * * SMT Packages Cellular Phone LCD Backlighting Digital Camera Flash Mobile Appliance Key Pads - White LEDs - Blue LEDs LED Video Displays
*
* * * *
CxxxXT290-Sxx00-x Chip Diagram
Top View
Bottom View
Die Cross Section
R3CE, Rev. E Datasheet: CP
G*SiC LED Chip 300 x 300 m Gold Bond Pad 105 m Diameter
Backside Contact Metal Bottom View for -C
Cathode (-)
SiC Substrate t = 115 m Anode (+)
Bottom View for -D
Subject to change without notice. www.cree.com
Maximum Ratings at TA = 25C Notes 2&4 DC Forward Current Peak Forward Current (1/10 duty cycle @ 1kHz) LED Junction Temperature Reverse Voltage Operating Temperature Range Storage Temperature Range Electrostatic Discharge Threshold (HBM)
Note 3 Note 3
CxxxXT290-Sxx00-x 30mA 100mA 125C 5V -40C to +100C -40C to +100C 1000V Class 2
Note 4
Electrostatic Discharge Classification (MIL-STD-883E)
Typical Electrical/Optical Characteristics at T = 25C, If = 20mA Part Number Forward Voltage (Vf, V) Min. C460XT290-Sxx00-x C470XT290-Sxx00-x C527XT290-S0100-A Mechanical Specifications Description P-N Junction Area (m) Top Area (m) Bottom Area (m) Chip Thickness (m) Au Bond Pad Diameter (m) Au Bond Pad Thickness (m) Back Contact Metal Area (m) Back Contact Metal Thickness (m) -C (Sn Flux Eutectic) Back Contact Metal Thickness (m) -D (Sn Eutectic) 2.7 2.7 2.7 Typ. 3.2 3.2 3.2 Max. 3.7 3.7 3.7
Reverse Current [I(Vr=5V), A] Max. 2 2 2
Full Width Half Max (D, nm) Typ. 21 22 35 CxxxXT290-Sxx00-x Dimension 250 x 250 200 x 200 300 x 300 115 105 1.2 210 x 210 2.0 0.5 Tolerance 25 25 25 15 -5, +15 0.5 25 0.3 0.1
Notes:
1.
2.
3. 4.
5. 6. 7.
This product is intended for use in a pre-molded surface mount package. It should be tested in the package and environment consistent with the final use to validate applicability. CxxxXT290-Sxx00-C and -D are not intended for use where extended reliable operation in high temperature and high humidity environments is required. For this condition or for use in a leaded radial lamp, use CxxxXT290-Sxx00-A. See Cree XThin Applications Note for more information. Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000 epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die but by the effect of the LED junction temperature on the package. The junction temperature limit of 125C is a limit of the T-1 3/4 package; junction temperature should be characterized in a specific package to determine limitations. Assembly processing temperature must not exceed 325C (< 5 seconds). See Cree XThin Applications Note for more assembly process information. Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown. The RAET procedure is performed on each die. The ESD classification of Class 2 is based on sample testing according to MIL-STD-883E. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled and operated at 20 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average values expected by manufacturer in large quantities and are provided for information only. All measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy). Optical characteristics measured in an integrating sphere using Illuminance E. Caution: To avoid leakage currents and achieve maximum output efficiency, die attach material must not contact the side of the chip. See Cree XThin Applications Note for more information. Specifications are subject to change without notice. XThin chips are shipped with the junction side down, not requiring a die transfer prior to die attach.
Copyright (c) 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G*SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc.
Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com
2
CPR3CE Rev. E
Standard Bins for XT290
LED chips are sorted to the radiant flux and dominant wavelength bins shown. A sorted die sheet contains die from only one bin. Sorted die kit (CxxxXT290-Sxx00-x) orders may be filled with any or all bins (CxxxXB290-01xx-x) contained in the kit. All radiant flux and all dominant wavelength values shown and specified are at If = 20 mA.
XT-24 Radiant Flux 24.0 mW 455 nm
C460XT290-0117-x
C460XT290-S2400-x
C460XT290-0118-x C460XT290-0119-x C460XT290-0120-x
457.5 nm
460 nm Dominant Wavelength C460XT290-S200-x
462.5 nm
465 nm
XT-2 Radiant Flux 24.0 mW
C460XT290-0117-x C460XT290-0113-x
C460XT290-0118-x C460XT290-0114-x
C460XT290-0119-x C460XT290-0115-x
C460XT290-0120-x C460XT290-0116-x
21.0 mW 455 nm
457.5 nm
460 nm Dominant Wavelength C460XT290-S800-x
462.5 nm
465 nm
XT-8 Radiant Flux 24.0 mW 21.0 mW
C460XT290-0117-x C460XT290-0113-x C460XT290-0109-x
C460XT290-0118-x C460XT290-0114-x C460XT290-0110-x
C460XT290-0119-x C460XT290-0115-x C460XT290-0111-x
C460XT290-0120-x C460XT290-0116-x C460XT290-0112-x
18.0 mW 455 nm
457.5 nm
460 nm Dominant Wavelength C460XT290-S600-x
462.5 nm
465 nm
XT-6 24.0 mW 21.0 mW 18.0 mW
C460XT290-0117-x C460XT290-0113-x C460XT290-0109-x C460XT290-0105-x
C460XT290-0118-x C460XT290-0114-x C460XT290-0110-x C460XT290-0106-x
C460XT290-0119-x C460XT290-0115-x C460XT290-0111-x C460XT290-0107-x
C460XT290-0120-x C460XT290-0116-x C460XT290-0112-x C460XT290-0108-x
Radiant Flux
16.0 mW 455 nm
457.5 nm
460 nm Dominant Wavelength
462.5 nm
465 nm
Copyright (c) 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G*SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc.
Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com
3
CPR3CE Rev. E
Standard Bins for XT290 (continued)
XT-2
C460XT290-0117-x
C460XT290-S200-x
C460XT290-0118-x C460XT290-0114-x C460XT290-0110-x C460XT290-0106-x C460XT290-0102-x C460XT290-0119-x C460XT290-0115-x C460XT290-0111-x C460XT290-0107-x C460XT290-0103-x C460XT290-0120-x C460XT290-0116-x C460XT290-0112-x C460XT290-0108-x C460XT290-0104-x
24.0 mW Radiant Flux 21.0 mW 18.0 mW 16.0 mW
C460XT290-0113-x C460XT290-0109-x C460XT290-0105-x C460XT290-0101-x
12.0 mW 455 nm
457.5 nm
460 nm Dominant Wavelength C470XT290-S200-x
462.5 nm
465 nm
XT-2 Radiant Flux 21.0 mW 465 nm
C470XT290-0113-x
C470XT290-0114-x
C470XT290-0115-x
C470XT290-0116-x
467.5 nm
470 nm Dominant Wavelength C470XT290-S800-x
472.5 nm
475 nm
XT-8 Radiant Flux 21.0 mW
C470XT290-0113-x C470XT290-0109-x
C470XT290-0114-x C470XT290-0110-x
C470XT290-0115-x C470XT290-0111-x
C470XT290-0116-x C470XT290-0112-x
18.0 mW 465 nm
467.5 nm
470 nm Dominant Wavelength C470XT290-S600-x
472.5 nm
475 nm
XT-6 Radiant Flux 21.0 mW 18.0 mW
C470XT290-0113-x C470XT290-0109-x
C470XT290-0114-x C470XT290-0110-x
C470XT290-0115-x C470XT290-0111-x
C470XT290-0116-x C470XT290-0112-x
16.0 mW 465 nm
467.5 nm
470 nm Dominant Wavelength
472.5 nm
475 nm
Copyright (c) 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G*SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc.
Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com
4
CPR3CE Rev. E
Standard Bins for XT290 (continued)
XT-2
C470XT290-0113-x
C470XT290-S200-x
C470XT290-0114-x C470XT290-0110-x C470XT290-0106-x C470XT290-0102-x C470XT290-0115-x C470XT290-0111-x C470XT290-0107-x C470XT290-0103-x C470XT290-0116-x C470XT290-0112-x C470XT290-0108-x C470XT290-0104-x
Radiant Flux
21.0 mW
C470XT290-0109-x
18.0 mW 16.0 mW
C470XT290-0105-x C470XT290-0101-x
12.0 mW 465 nm
467.5 nm
470 nm Dominant Wavelength C527XT290-S000-x
472.5 nm
475 nm
XT-2
C527XT290-0110-x
C527XT290-0111-x C527XT290-0108-x C527XT290-0105-x C527XT290-0102-x
C527XT290-0112-x C527XT290-0109-x C527XT290-0106-x C527XT290-0103-x
Radiant Flux
10.0 mW 9.0 mW 8.0 mW
C527XT290-0107-x C527XT290-0104-x C527XT290-0101-x
7.0 mW 520 nm
525 nm 530 nm Dominant Wavelength
535 nm
Copyright (c) 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G*SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc.
Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com
5
CPR3CE Rev. E
Characteristic Curves
These are representative measurements for the XThin product. Actual curves will vary slightly for the various radiant flux and dominant wavelength bins.
Forward Current vs. Forward Voltage
16.0
Wavelength Shift vs Forward Current
30
14.0
25
12.0 10.0
20
Shift (nm) 8.0 6.0 4.0 2.0 0.0
If (mA)
15
10
5
-2.0
527nm 470 nm
0 0.0 0.5 1.0 1.5 2.0 2.5 Vf (V) 3.0 3.5 4.0 4.5 5.0
-4.0 0 5 10 15 If(mA) 20 25 30
Relative Intensity vs Forward Current
140
100
Relative Intensity vs Peak Wavelength
120
80 Relative Intensity (%)
100 % Intensity
60
80
60
40
40
20
20
0 0 5 10 15 If(mA) 20 25 30
400 500 Wavelength (nm) 600
Copyright (c) 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G*SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc.
Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com
6
CPR3CE Rev. E

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